- √产品展示
- 倒封装机
- 倒贴片机
- 天线打样机
- 电子标签封装机
- 推力测试机
- 电子标签打样机
- 电子标签热压机
- TO封装设备
- RFID Bonding Machine
- RFID Antenna Machine
- RFID Die Bonding Machine
- RFID Die Shear Tester
FCB-320 RFID Die Bonding Machine
- 详情
FCB-320 Technology Specifications
Both vision system, one for die, another for antenna;
Both display, independent working, imagine suitable;
Independent heat pressure system, change easily and high accuracy;
Adopt PLC + temperature module + tough screen, steady temperature control;
Die dimension can exceed 2mm;
Operation easily, maintain easily;
Suitable RFID electronic tags product technology test, making sample, and small-quantity production;
FCB-320 Technology Specifications
Machine Dimension：L640mm*W460mm*H600mm;
Machine Weight and Power：About35kg, 200W;
Heat Pressure Range：0.55N~2N ±0.08N;
Heat Pressure Temperature：50~250 ℃ ±1 ℃;
Die Dimension: 0.3mm x 0.3mm ~2.5mm x 2.5mm，UF, UHF;
Die Supply：Tray Plate;
Product Dimension：Antenna ≤120mm x 100mm;
Vision System：Two (Upper for antenna, Below for Die) ；
Control Method and Power Supply：PLC Control, 220VAC;
Die Bonding Accuracy：±20 um;
上一个：无
下一个：无